Technology Capability

工藝能力

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Process ability
N0. project technical indication
1 layer number 2-12 layer (layers)
2 working board size (maximum) 546mm*624mm
3 plate thickness 0.2mm-3.5mm
4 Product board thickness tolerance plate thickness 0.2mm-1.0mm + 0.1mm
plate thickness 1.01mm-1.6mm + 0.13mm
plate thickness 1.61mm-3.5mm + 0.15mm
5 plate curve (minimum) = 0.7%
6 borehole aperture 0.2mm-6.5mm
minimum drilling TM 0.2mm, finished product aperture 0.15mm
minimum length of long strip hole 0.6mm
long hole aperture tolerance NPTH + 0.05mm
long hole aperture tolerance PTH + 0.08mm
7 , the thickness of copper at the bottom of the outer layer is 1/3oz-3oZ
8 sheet type FR4, halogen free FR4, high TGFR4, Teflon, Rogers, CEM-3
9 hole electroplating longitudinal and transverse ratio (maximum) 8:1
10 aperture tolerance PTH + 0.075mm
NPTH + 0.05mm
11 hole wall copper thick = 18um
12 inner line width / line distance (minimum) H/H (0.075mm/0.075mm) 1/1 (0.1mm/0.1mm); 1/1; ";"; ";"; ";"; ";"; ";"; ";" 2/2 (0.15mm/0.15mm) and
13 outer line width / line distance (minimum) T/T (0.075mm/0.075mm)
. H/H (0.1mm/0.1mm)
. 1/1 (0.127mm/0.127mm)
. 2/2 (0.178mm/0.178mm) and
14 solder bridge width (minimum) 0.08mm
15 external tolerance (minimum hole to edge) + 0.1mm
16 thermal shock 288 C 10 sec (3)
17 anti peeling strength = 1.4N/mm
18 impedance control tolerance + 10%
19 resistance welding layer strength > 6H
20 surface treatment OSP, gold, lead, tin, lead-free, tin, silver, tin, carbon, blue and